Overview

Gender

male

Ziad Mansour served as Senior Vice President of Engineering leading the Digital Hardware group in Qualcomm CDMA Technologies (QCT) division. In this role, Mansour provided technical and management leadership for a cross functional engineering team, spread across the U.S. and India, executing on the Cellular and Computing product (CPG, CCP) roadmap.

Under Mansour’s leadership, the team has strengthened its expertise and scaled to the size and output levels required to support QCT’s business, which has shipped more than 15 billion cumulative chips (ASICs) and 861M MSMs in CY14.

Prior to his most recent position, Mansour held various leadership roles at Qualcomm. He joined the company in 1995 as a staff engineer leading the GUM ASIC on the Globalstar project. Quickly advancing within the organization, Mansour moved to QCT’s VLSI group in 1997. He was promoted to vice president in 2002, assuming responsibility for the MSM chip development team.

Prior to Qualcomm, Mansour held chip, board and system design/project lead positions at General Dynamics, TRW and Titan Linkabit all in support of communication systems. Mansour holds patents in modem and low power implementation. Mansour holds a MS and BS in Electrical Engineering from San Diego State University.